MC10H161M资料

MC10H161

Binary to 1−8 Decoder(Low)

Description

The MC10H161 provides parallel decoding of a three bit binaryword to one of eight lines. The MC10H161 is useful in high−speedmultiplexer/demultiplexer applications.The MC10H161 is designed to decode a three bit input word to oneof eight output lines. The MC10H161 output will be low whenselected while all other output are high. The enable inputs, when eitheror both are high, force all outputs high.The MC10H161 is a true parallel decoder. This eliminates unequalparallel path delay times found in other decoder designs. Thesedevices are ideally suited for multiplexer/demultiplexer applications.Features

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MARKING DIAGRAMS*16MC10H161LAWLYYWWCDIP−16L SUFFIXCASE 620A1•Propagation Delay, 1.0 ns Typical

•Power Dissipation, 315 mW Typical (same as MECL 10K™)•Improved Noise Margin 150 mV (Over Operating Voltage and•••

Temperature Range)Voltage CompensatedMECL 10K Compatible

Pb−Free Packages are Available*

DIP PIN ASSIGNMENT

VCC1E0Q3Q2Q1Q0AVEE

12345678

161514131211109

VCC2E1Pin assignment is for Dual−in−LineC

Package. For PLCC pin assignment, seeQ4the Pin Conversion Tables on page 18 ofQ5

16161PDIP−16P SUFFIXCASE 81MC10H161PAWLYYWWG10H161ALYWGQ6Q7B

the ON Semiconductor MECL DataBook (DL122/D).SOEIAJ−16CASE 966120LOGIC DIAGRAME0󰀁2E1󰀁15VCC1=Pin 1VCC2=Pin 16VEE=Pin 8A󰀁76󰀁Q0ENABLEINPUTS5󰀁Q1E1E0LLLL4󰀁Q2LLLL3󰀁Q3LLLL13󰀁Q4LLLL12󰀁Q5HXXH11󰀁Q6C󰀁1410󰀁Q7TRUTH TABLEINPUTSOUTPUTSCBAQ0Q1Q2Q3Q4Q5LLLLHHHHHLLHHLHHHHLHLHHLHHHLHHHHHLHHHLLHHHHLHHLHHHHHHLHHLHHHHHHHHHHHHHHHXXXHHHHHHXXXHHHHHH201PLLC−20FN SUFFIXCASE 775AWL, LYY, YWW, WG10H161GAWLYYWWB󰀁9Q6HHHHHHLHHHQ7HHHHHHHLHH= Assembly Location= Wafer Lot= Year= Work Week=Pb−Free Package*For additional marking information, refer to Application Note AND8002/D.*For additional information on our Pb−Free strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting TechniquesReference Manual, SOLDERRM/D.

ORDERING INFORMATION

See detailed ordering and shipping information in the packagedimensions section on page 4 of this data sheet.

© Semiconductor Components Industries, LLC, 2006

February, 2006 − Rev. 7

1Publication Order Number:

MC10H161/D

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MC10H161

Table 1. MAXIMUM RATINGS

SymbolVEEVIIoutTATstg

Power Supply (VCC = 0)Input Voltage (VCC = 0)Output Current

− Continuous− Surge

Characteristic

Rating−8.0 to 00 to VEE501000 to +75−55 to +150−55 to +165

UnitVdcVdcmA°C°C°C

Operating Temperature Range

Storage Temperature Range− Plastic

− Ceramic

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limitvalues (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.

Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)

0°

SymbolIEIinHIinLVOHVOLVIHVIL

Characteristic

Power Supply CurrentInput Current HighInput Current LowHigh Output VoltageLow Output VoltageHigh Input VoltageLow Input Voltage

Min−−0.5−1.02−1.95−1.17−1.95

Max84465−−0.84−1.63−0.84−1.48

Min−−0.5−0.98−1.95−1.13−1.95

25°

Max76275−−0.81−1.63−0.81−1.48

Min−−0.3−0.92−1.95−1.07−1.95

75°

Max84275−−0.735−1.60−0.735−1.45

UnitmAmAmAVdcVdcVdcVdc

1.Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has beenestablished. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm ismaintained. Outputs are terminated through a 50 W resistor to −2.0 V.

Table 3. AC PARAMETERS

0°

Symboltpd

Characteristic

Propagation Delay

DataEnableRise TimeFall Time

Min0.60.80.550.55

Max2.02.31.71.7

Min0.650.80.650.65

25°

Max2.12.41.81.8

Min0.70.90.70.7

75°

Max2.22.51.91.9

nsnsUnitns

trtf

NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limitvalues are applied individually under normal operating conditions and not valid simultaneously.

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MC10H161

TYPICAL APPLICATIONS

HIGH SPEED 16−BIT MULTIPLEXER/DEMULTIPLEXER

Control Selection

S0S1CRAMC10H136BCD15141312111098763210E1CBAMC10H1D0E1CBAMC10H1D0S0S0S1CRAMC10H136BCDE1CBAE0MC10H161E1CBAE0MC10H161S1CRStart/Stop151413121110987632101−OF− LINE MULTIPLEXEREABCMC10H1ABCMC10H1ABCMC10H114MSBQ7Q6Q5Q4Q3Q2Q1Q0ABCMC10H1ABCMC10H1ABCMC10H1ABCMC10H1ABCMC10H1DoutDoutDoutDoutDoutDoutDoutDoutEEE9MC10H1617LSBEEEThe Bit chosen is dependent on six−bitcode present on inputs 7, 9, 14 of theMC10H161 and the A, B, C inputs of theMC10H1.Ehttp://onsemi.com

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MC10H161

ORDERING INFORMATION

Device

MC10H161FNMC10H161FNGMC10H161FNR2MC10H161FNR2GMC10H161LMC10H161MMC10H161MGMC10H161MELMC10H161MELGMC10H161PMC10H161PG

PackagePLLC−20PLLC−20(Pb−Free)PLLC−20PLLC−20(Pb−Free)CDIP−16SOEIAJ−16SOEIAJ−16(Pb−Free)SOEIAJ−16SOEIAJ−16(Pb−Free)PDIP−16PDIP−16(Pb−Free)

Shipping†46 Units / Rail46 Units / Rail500 / Tape & Reel500 / Tape & Reel25 Unit / Rail50 Unit / Rail50 Unit / Rail2000 / Tape & Reel2000 / Tape & Reel25 Unit / Rail25 Unit / Rail

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.

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MC10H161

PACKAGE DIMENSIONS

20 LEAD PLLCCASE 775−02ISSUE E

B−N−Y BRKD−L−−M−WDV0.010 (0.250) STL−MNZ0.007 (0.180) MTL−MUSNSS0.007 (0.180) MTL−MNS201XVIEW D−DG1SSAZR0.007 (0.180) MTL−M0.007 (0.180) MTL−MSNNSSSHK10.007 (0.180) MTL−MSNSCEGG10.010 (0.250) STL−M

0.004 (0.100)J−T−VIEW SSSEATINGPLANEKFVIEW S0.007 (0.180) MTL−MSNSN

SNOTES:

1.DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,1982.

2.DIMENSIONS IN INCHES.

3.DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOPOF LEAD SHOULDER EXITS PLASTIC BODY AT MOLDPARTING LINE.

4.DIMENSION G1, TRUE POSITION TO BE MEASURED ATDATUM −T−, SEATING PLANE.

5.DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.6.DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLERTHAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).DIMENSIONS R AND U ARE DETERMINED AT THEOUTERMOST EXTREMES OF THE PLASTIC BODYEXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATEBURRS AND INTERLEAD FLASH, BUT INCLUDING ANYMISMATCH BETWEEN THE TOP AND BOTTOM OF THEPLASTIC BODY.

7.DIMENSION H DOES NOT INCLUDE DAMBARPROTRUSION OR INTRUSION. THE DAMBAR

PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSIONTO BE GREATER THAN 0.037 (0.940). THE DAMBAR

INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TOBE SMALLER THAN 0.025 (0.635).

DIMABCEFGHJKRUVWXYZG1K1INCHESMINMAX0.3850.3950.3850.3950.1650.1800.0900.1100.0130.0190.050 BSC0.0260.0320.020−−−0.025−−−0.3500.3560.3500.3560.0420.0480.0420.0480.0420.056−−−0.0202 10 __0.3100.3300.040−−−MILLIMETERS

MINMAX9.7810.039.7810.034.204.572.292.790.330.481.27 BSC0.660.810.51−−−0.−−−8.9.048.9.041.071.211.071.211.071.42−−−0.502 10 __7.888.381.02−−−http://onsemi.com

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MC10H161

PACKAGE DIMENSIONS

SOEIAJ−16CASE 966−01ISSUE A

169LEQ1EHEM_LDETAIL P18ZDAVIEW PcNOTES:

1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.

2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSIONS D AND E DO NOT INCLUDE MOLDFLASH OR PROTRUSIONS AND ARE MEASUREDAT THE PARTING LINE. MOLD FLASH ORPROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)PER SIDE.4.TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.5.THE LEAD WIDTH DIMENSION (b) DOES NOTINCLUDE DAMBAR PROTRUSION. ALLOWABLEDAMBAR PROTRUSION SHALL BE 0.08 (0.003)TOTAL IN EXCESS OF THE LEAD WIDTHDIMENSION AT MAXIMUM MATERIAL CONDITION.DAMBAR CANNOT BE LOCATED ON THE LOWERRADIUS OR THE FOOT. MINIMUM SPACEBETWEEN PROTRUSIONS AND ADJACENT LEADTO BE 0.46 ( 0.018).DIMAA1bcDEeHELLEMQ1ZMILLIMETERSMINMAX−−−2.050.050.200.350.500.100.209.9010.505.105.451.27 BSC7.408.200.500.851.101.500 _10 _0.700.90−−−0.78INCHESMINMAX−−−0.0810.0020.0080.0140.0200.0070.0110.3900.4130.2010.2150.050 BSC0.2910.3230.0200.0330.0430.0590 _10 _0.0280.035−−−0.031eb0.13 (0.005)MA10.10 (0.004)CDIP−16L SUFFIX

CERAMIC DIP PACKAGE

CASE 620A−01ISSUE OB16A9AMLB18NOTES:

1.DIMENSIONING AND TOLERANCING PERASME Y14.5M, 1994.

2.CONTROLLING DIMENSION: INCH.

3.DIMENSION L TO CENTER OF LEAD WHENFORMED PARALLEL.

4.DIMENSION F MAY NARROW TO 0.76 (0.030)WHERE THE LEAD ENTERS THE CERAMICBODY.

5THIS DRAWING REPLACES OBSOLETECASE OUTLINE 620−10.

DIMABCDEFGHKLMNINCHESMINMAX0.7500.7850.2400.295−−−0.2000.0150.0200.050 BSC0.0550.0650.100 BSC0.0080.0150.1250.1700.300 BSC0 _15 _0.0200.040MILLIMETERSMINMAX19.0519.936.107.49−−−5.080.390.501.27 BSC1.401.652. BSC0.210.383.184.317.62 BSC0 _15 _0.511.0116XJEFCKTNG16X0.25 (0.010)MTBSEATINGPLANED0.25 (0.010)

MTA

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MC10H161

PACKAGE DIMENSIONS

PDIP−16P SUFFIX

PLASTIC DIP PACKAGE

CASE 8−08ISSUE R9−A−16B18NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.

2.CONTROLLING DIMENSION: INCH.

3.DIMENSION L TO CENTER OF LEADS WHENFORMED PARALLEL.

4.DIMENSION B DOES NOT INCLUDE MOLD FLASH.5.ROUNDED CORNERS OPTIONAL.

DIMABCDFGHJKLMSINCHESMINMAX0.7400.7700.2500.2700.1450.1750.0150.0210.0400.700.100 BSC0.050 BSC0.0080.0150.1100.1300.2950.3050 _10 _0.0200.040MILLIMETERSMINMAX18.8019.556.356.853.694.440.390.531.021.772. BSC1.27 BSC0.210.382.803.307.507.740 _10 _0.511.01FSCL−T−HKGD16 PLSEATINGPLANEJTAMM

0.25 (0.010)MMECL 10H and MECL 10K are trademarks of Motorola, Inc.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:N. American Technical Support: 800−282−9855 Toll FreeLiterature Distribution Center for ON SemiconductorUSA/CanadaP.O. Box 61312, Phoenix, Arizona 85082−1312 USAPhone: 480−829−7710 or 800−344−3860 Toll Free USA/CanadaJapan: ON Semiconductor, Japan Customer Focus Center2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051Fax: 480−829−7709 or 800−344−3867 Toll Free USA/CanadaPhone: 81−3−5773−3850Email: orderlit@onsemi.comON Semiconductor Website: http://onsemi.comOrder Literature: http://www.onsemi.com/litorderFor additional information, please contact yourlocal Sales Representative.http://onsemi.com7MC10H161/D