Adhesive composition and its use

专利名称：Adhesive composition and its use发明人：竹谷 伸幸,中村 賢一,橋本 祐介申请号：JP2019568887申请日：20181128

公开号：JPWO2019150728A1公开日：20201203

摘要：PROBLEM TO BE SOLVED: To provide an adhesive composition having excellentheat resistance capable of suppressing a fine foaming phenomenon even under hightemperature and high humidity conditions. A first pressure-sensitive adhesivecomposition containing a vinyl polymer (A) and an acrylic pressure-sensitive adhesivepolymer (B), which is a glass transition temperature of the entire pressure-sensitiveadhesive layer formed from the pressure-sensitive adhesive composition. Tg is -80 ° C orhigher and 10 ° C or lower, and the second Tg, which is the glass transition temperaturecalculated from the surface layer portion of the pressure-sensitive adhesive layerobtained by X-ray photoelectron spectroscopic analysis, is the first Tg. 30 ° C. or higher,and the pressure-sensitive adhesive layer has a shear storage elastic modulus at 85 ° C.obtained by dynamic viscoelasticity measurement of 5.0 × 10 Pa or more and 5.0 × 10 Paor less. ..

申请人：東亞合成株式会社

地址：東京都港区西新橋１丁目１４番１号

国籍：JP

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