PCB电路板步骤流程外贸英文翻译

Process说明 :

A. 下料 ( Cut Lamination)

a-1 裁板 ( Sheets Cutting)

a-2 原物料发料 (Panel)(Shear material to Size) B. 钻孔 (Drilling)

b-1 内钻 (Inner Layer Drilling )

b-2 一次孔(Outer Layer Drilling )

b-3 二次孔 (2nd Drilling)

b-4 雷射钻孔 (Laser Drilling )(Laser Ablation )

b-5 盲(埋)孔钻孔 (Blind & Buried Hole Drilling) C. 乾膜制程 ( Photo Process(D/F))

c-1 前处理 (Pretreatment)

c-2 压 膜 (Dry Film Lamination)

c-3 曝 光 (Exposure)

c-4 显 影 (Developing)

c-5 蚀铜 (Etching)

c-6 去膜 (Stripping)

c-7 初检 ( Touch-up)

c-8 化学前处理,化学研磨 ( Chemical Milling )

c-9 选择性浸金压膜 (Selective Gold Dry Film Lamination)

c-10 显 影(Developing )

c-11 去膜(Stripping )

D. 压 合 Lamination

d-1 黑 化 (Black Oxide Treatment)

d-2 微 蚀 (Microetching)

d-3 铆钉组合 (eyelet )

d-4 叠板 (Lay up)

d-5 压 合 (Lamination)

d-6 后处理 (Post Treatment)

d-7 黑氧化 ( Black Oxide Removal )

d-8 铣靶 (spot face)

d-9 去溢胶 (resin flush removal)

E. 减铜 (Copper Reduction)

e-1 薄化铜(Copper Reduction)

F. 电镀 (Horizontal Electrolytic Plating)

f-1 水平电镀 (Horizontal Electro-Plating) (Panel Plating)

f-2 锡铅电镀 ( Tin-Lead Plating ) (Pattern Plating)

f-3 低於 1 mil ( Less than 1 mil Thickness )

f-4 高於 1 mil ( More than 1 mil Thickness)

f-5 砂带研磨 (Belt Sanding)

f-6 剥锡铅 ( Tin-Lead Stripping)

f-7 微切片 ( Microsection)

G. 塞孔 (Plug Hole)

g-1 印刷 ( Ink Print )

g-2 预烤 (Precure)

g-3 表面刷磨 (Scrub)

g-4 后烘烤 (Postcure)

H. 防焊(绿漆): (Solder Mask)

h-1 C面印刷 (Printing Top Side)

h-2 S面印刷 (Printing Bottom Side)

h-3 静电喷涂 (Spray Coating)

h-4 前处理 (Pretreatment)

h-5 预烤 (Precure)

h-6 曝光 (Exposure)

h-7 显影 (Develop)

h-8 后烘烤 (Postcure)

h-9 UV烘烤 (UV Cure)

h-10 文字印刷 ( Printing of Legend )

h-11 喷砂 ( Pumice)(Wet Blasting)

h-12 印可剥离防焊 (Peelable Solder Mask)

I . 镀金 Gold plating

i-1 金手指镀镍金 ( Gold Finger )

i-2 电镀软金 (Soft Ni/Au Plating)

i-3 浸镍金 ( Immersion Ni/Au) (Electroless Ni/Au)

J. 喷锡 (Hot Air Solder Leveling)

j-1 水平喷锡 (Horizontal Hot Air Solder Leveling)

j-2 垂直喷锡 ( Vertical Hot Air Solder Leveling)

j-3 超级焊锡 (Super Solder )

j-4. 印焊锡突点 (Solder Bump)

K. 成型 (Profile)(Form)

k-1 捞型 (N/C Routing ) (Milling)

k-2 模具冲 (Punch)

k-3 板面清洗烘烤 (Cleaning & Backing)

k-4 V型槽 ( V-Cut)(V-Scoring)

k-5 金手指斜边 ( Beveling of G/F)

L. 短断路测试 (Electrical Testing) (Continuity & Insulation Testing)

l-1 AOI 光学检查 ( AOI Inspection)

l-2 VRS 目检 (Verified & Repaired)

l-3 泛用型治具测试 (Universal Tester)

l-4 专用治具测试 (Dedicated Tester)

l-5 飞针测试 (Flying Probe)

M. 终检 ( Final Visual Inspection)

m-1 压板翘 ( Warpage Remove)

m-2 X-OUT 印刷 (X-Out Marking)

m-3 包装 及出货 (Packing & shipping)