专利名称：Enhancement of performance of a
conductive wire in a multilayered substrate
发明人：Jason P. Gill,David L. Harmon,Deborah M.
Massey,Alvin W. Strong,Timothy D.Sullivan,Junichi Furukawa
申请号：US11442911申请日：20060530
公开号：US20060226142A1公开日：20061012
专利附图：
摘要：An electronic structure having wiring, and an associated method of designing
the structure, for limiting a temperature gradient in the wiring. The electronic structureincludes a substrate having a layer that includes a first and second wire which do notphysically touch each other. The first and second wires are adapted to be at an elevatedtemperature due to Joule heating in relation to electrical current density in the first andsecond wires. The first wire is electrically and thermally coupled to the second wire by anelectrically and thermally conductive structure that exists outside of the layer. The widthof the second wire is tailored so as to limit a temperature gradient in the first wire to bebelow a threshold value that is predetermined to be sufficiently small so as tosubstantially mitigate adverse effects of electromigration in the first wire.
申请人：Jason P. Gill,David L. Harmon,Deborah M. Massey,Alvin W. Strong,Timothy D.Sullivan,Junichi Furukawa
地址：Essex Junction VT US,Essex VT US,Jericho VT US,Essex Junction VT US,UnderhillVT US,Pittsburgh PA US
国籍：US,US,US,US,US,US
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