Mounting method and mounting device

专利名称：Mounting method and mounting device发明人：Akira Yamauchi,Katsumi Terada,Satoru

Naraba,Takashi Hare

申请号：US10511986申请日：20030422公开号：US07279358B2公开日：20071009

专利附图：

摘要：A mounting method includes the steps of, after positioning objects beingbonded relative to each other, moving a movable wall positioned there around untilcoming into contact with one object holding means to form a local chamber having a local

enclosed space, enclosing both objects in the chamber, reducing the pressure in thechamber, moving the object holding means in a direction for reducing the volume of thechamber and moving the movable wall following the movement of the object holdingmeans, and bonding both objects to each other by pressing. Since the bonding part andthe vicinity of the bonding part can be locally and efficiently enclosed from thesurroundings, and the local chamber can vary the shape of the enclosed space with thebonding operation while maintaining the enclosed state even at the time of bonding.

申请人：Akira Yamauchi,Katsumi Terada,Satoru Naraba,Takashi Hare

地址：Shiga JP,Shiga JP,Shiga JP,Shiga JP

国籍：JP,JP,JP,JP

代理机构：Smith Patent Office

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