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120-VBoot,4-APeak,HighFrequencyHigh-SideandLow-SideDriver
CheckforSamples:UCC27210,UCC27211
FEATURES
•
DrivesTwoN-ChannelMOSFETsinHigh-SideandLow-SideConfigurationwithIndependentInputs
MaximumBootVoltage120-VDC
4-ASink,4-ASourceOutputCurrents0.9-ΩPull-UpandPull-DownResistance
InputPinscanTolerate-10Vto20VandareIndependentofSupplyVoltageRangeTTLorPseudo-CMOSCompatibleInputVersions
8-Vto17-VVDDOperatingRange,(20-VABSMAX)
7.2-nsRiseand5.5-nsFallTimewith1000-pFLoad
FastPropagationDelayTimes(18nstypical)2-nsDelayMatching
SymmetricalUnderVoltageLockoutforHigh-SideandLow-SideDriver
AllIndustryStandardPackagesAvailable(SOIC-8,PowerPAD™SOIC-8,4-mmx4-mmSON-8and4-mmx4-mmSON-10)Specifiedfrom-40to140°C
APPLICATIONS
•••••••
PowerSuppliesforTelecom,Datacom,andMerchant
Half-BridgeandFull-BridgeConvertersPush-PullConverters
HighVoltageSynchronous-BuckConvertersTwo-SwitchForwardConvertersActive-ClampForwardConvertersClass-DAudioAmplifiers
•••••••••••
DESCRIPTION
TheUCC27210andUCC27211DriversarebasedonthepopularUCC27200andUCC27201MOSFETdrivers,butofferseveralsignificantperformanceimprovements.Peakoutputpull-upandpull-downcurrenthasbeenincreasedto4-Asourceand4-Asink,andpull-upandpull-downresistancehavebeenreducedto0.9Ω,therebyallowingfordrivinglargepowerMOSFETswithminimizedswitchinglossesduringthetransitionthroughtheMOSFET’sMillerPlateau.Theinputstructureisnowabletodirectlyhandle-10VDC,whichincreasesrobustnessandalsoallowsdirectinterfacetogate-drivetransformerswithoutusingrectificationdiodes.Theinputsarealsoindependentofsupplyvoltageandhavea20-Vmaximumrating.
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TypicalApplicationDiagrams
+12V+100V+12VVHBSECONDARYSIDECIRCUITVHB+100VSECONDARYSIDECIRCUITCONTROLPWMCONTROLLERLIHSPWMCONTROLLERLICONTROLHIDRIVEHIHOHIDRIVEHIHOHSDRIVELOUCC27210VSSLODRIVELOUCC27211VSSLOISOLATIONANDFEEDBACK+12VVDDHB+100VHICONTROLDRIVEHIHOHSLIDRIVELOUCC27211LOPleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.
PowerPADisatrademarkofTexasInstruments.
Copyright©2011–2013,TexasInstrumentsIncorporated
PRODUCTIONDATAinformationiscurrentasofpublicationdate.ProductsconformtospecificationsperthetermsoftheTexasInstrumentsstandardwarranty.Productionprocessingdoesnotnecessarilyincludetestingofallparameters.
UCC27210UCC27211
SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013
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DESCRIPTION(CONT.)
TheUCC27210/1’sswitchingnode(HSpin)isabletohandle-18Vmaximumwhichallowsthehigh-sidechanneltobeprotectedfrominherentnegativevoltagescausedparasiticinductanceandstraycapacitance.TheUCC27210(Pseudo-CMOSinputs)andUCC27211(TTLinputs)haveincreasedhysteresisallowingforinterfacetoanalogordigitalPWMcontrollerswithenhancednoiseimmunity.
Thelow-sideandhigh-sidegatedriversareindependentlycontrolledandmatchedto2nsbetweentheturnonandturnoffofeachother.
Anon-chip120-Vratedbootstrapdiodeeliminatestheexternaldiscretediodes.Under-voltagelockoutisprovidedforboththehigh-sideandthelow-sidedriversprovidingsymmetricturn-on/turn-offbehaviorandforcingtheoutputslowifthedrivevoltageisbelowthespecifiedthreshold.
Bothdevicesareofferedin8-pinSOIC(D),PowerPAD™SOIC-8(DDA),4-mmx4-mmSON-8(DRM)andSON-10(DPR)packages.
Thesedeviceshavelimitedbuilt-inESDprotection.TheleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoamduringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates.
ORDERINGINFORMATION
TEMPERATURERANGETA=TJ
INPUT
COMPATIBILITYPseudoCMOS
TTL
SOIC-8(D)(2)UCC27210DUCC27211D
(1)
PACKAGEDDEVICES(1)
PowerPAD™SOIC-8(DDA)(2)UCC27210DDAUCC27211DDA
SON-8(DRM)(3)UCC27210DRMUCC27211DRM
SON-10(DPR)(4)UCC27210DPRUCC27211DPR
-40°Cto140°C
(1)(2)(3)(4)
TheseproductsarepackagedinLead(Pb)-FreeandgreenleadfinishofPdNiAuwhichiscompatiblewithMSLlevel1at255°Cto260°CpeakreflowtemperaturetobecompatiblewitheitherleadfreeorSn/Pbsolderingoperations.
D(SOIC-8)andDDA(PowerPad™SOIC-8)packagesareavailabletapedandreeled.AddRsuffixtodevicetype(e.g.UCC27210ADR/UCC27211ADR)toorderquantitiesof2,500devicesperreel.
DRM(SON-8)packagecomeseitherinasmallreelof250piecesaspartnumberUCC27210ADRMT/UCC27211ADRMT,orlargerreelsof3000piecesaspartnumberUCC27210ADRMR/UCC27211ADRMR.
DPR(SON-10)packagecomeseitherinasmallreelof250piecesaspartnumberUCC27210ADPRT/UCC27211ADPRT,orlargereelsof3000piecesaspartnumberUCC27210ADPRR/UCC27211ADPRR.
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ABSOLUTEMAXIMUMRATINGS
overoperatingfree-airtemperaturerange(unlessotherwisenoted)
MIN
Supplyvoltagerange,VDD(1),VHB-VHSInputvoltagesonLIandHI,VLI,VHIOutputvoltageonLO,VLOOutputvoltageonHO,VHOVoltageonHS,VHSVoltageonHB,VHB
HumanBodyModel(HBM)
ESD
FieldInducedChargedDeviceModel(FICDM)
-40-65
DC
Repetitivepulse<100ns(2)DC
Repetitivepulse<100ns(2)DC
Repetitivepulse<100ns
(2)
MAX
-0.3-10-0.3-2
2020
VDD+0.3VDD+0.3VHB+0.3VHB+0.3
11511512021150150300
UNIT
VHS–0.3VHS-2
-1
-(24V-VDD)
-0.3
V
kV
Operatingvirtualjunctiontemperaturerange,TJStoragetemperature,TSTG
Leadtemperature(soldering,10sec.)(1)(2)
°C
AllvoltagesarewithrespecttoVSSunlessotherwisenoted.Currentsarepositiveinto,negativeoutofthespecifiedterminal.Verifiedatbenchcharacterization.VDDisthevalueusedinanapplicationdesign.
RECOMMENDEDOPERATINGCONDITIONS
allvoltagesarewithrespecttoVSS;currentsarepositiveintoandnegativeoutofthespecifiedterminal.–40°C Supplyvoltagerange,VDD,VHB-VHSVoltageonHS,VHS VoltageonHS,VHS(repetitivepulse<100ns)VoltageonHB,VHBVoltageslewrateonHS Operatingjunctiontemperaturerange -40MIN 8-1 -(24V-VDD) VHS+8,VDD–1 TYP 12 MAX 17105110VHS+17, 115 50140 V/ns°CVUNIT Copyright©2011–2013,TexasInstrumentsIncorporatedSubmitDocumentationFeedback3 ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 www.ti.com THERMALINFORMATION UCC27210/11(1) THERMALMETRIC θJAθJCtopθJBψJTψJBθJCbot(1)(2)(3)(4)(5)(6)(7) Junction-to-ambientthermalresistance(2)Junction-to-case(top)thermalresistance(3)Junction-to-boardthermalresistance(4)Junction-to-topcharacterizationparameter(5)Junction-to-boardcharacterizationparameter(6)Junction-to-case(bottom)thermalresistance(7) D8PINS111.856.953.07.852.3n/a DDA8PINS37.747.29.62.89.43.6 °C/WUNITS Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. Thejunction-to-ambientthermalresistanceundernaturalconvectionisobtainedinasimulationonaJEDEC-standard,high-Kboard,asspecifiedinJESD51-7,inanenvironmentdescribedinJESD51-2a. Thejunction-to-case(top)thermalresistanceisobtainedbysimulatingacoldplatetestonthepackagetop.NospecificJEDEC-standardtestexists,butaclosedescriptioncanbefoundintheANSISEMIstandardG30-88. Thejunction-to-boardthermalresistanceisobtainedbysimulatinginanenvironmentwitharingcoldplatefixturetocontrolthePCBtemperature,asdescribedinJESD51-8. Thejunction-to-topcharacterizationparameter,ψJT,estimatesthejunctiontemperatureofadeviceinarealsystemandisextractedfromthesimulationdataforobtainingθJA,usingaproceduredescribedinJESD51-2a(sections6and7). Thejunction-to-boardcharacterizationparameter,ψJB,estimatesthejunctiontemperatureofadeviceinarealsystemandisextractedfromthesimulationdataforobtainingθJA,usingaproceduredescribedinJESD51-2a(sections6and7). Thejunction-to-case(bottom)thermalresistanceisobtainedbysimulatingacoldplatetestontheexposed(power)pad.NospecificJEDECstandardtestexists,butaclosedescriptioncanbefoundintheANSISEMIstandardG30-88.THERMALINFORMATION UCC27210/11(1) THERMALMETRIC θJAθJCtopθJBψJTψJBθJCbot(1)(2)(3)(4)(5)(6)(7) Junction-to-ambientthermalresistance(2)Junction-to-case(top)thermalresistanceJunction-to-boardthermalresistance (4) (5)(3) DRM8PINS33.933.211.40.411.72.3 (7) DPR10PINS36.836.014.00.314.23.4 UNITS Junction-to-topcharacterizationparameter °C/W Junction-to-boardcharacterizationparameter(6)Junction-to-case(bottom)thermalresistance Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. Thejunction-to-ambientthermalresistanceundernaturalconvectionisobtainedinasimulationonaJEDEC-standard,high-Kboard,asspecifiedinJESD51-7,inanenvironmentdescribedinJESD51-2a. Thejunction-to-case(top)thermalresistanceisobtainedbysimulatingacoldplatetestonthepackagetop.NospecificJEDEC-standardtestexists,butaclosedescriptioncanbefoundintheANSISEMIstandardG30-88. Thejunction-to-boardthermalresistanceisobtainedbysimulatinginanenvironmentwitharingcoldplatefixturetocontrolthePCBtemperature,asdescribedinJESD51-8. Thejunction-to-topcharacterizationparameter,ψJT,estimatesthejunctiontemperatureofadeviceinarealsystemandisextractedfromthesimulationdataforobtainingθJA,usingaproceduredescribedinJESD51-2a(sections6and7). Thejunction-to-boardcharacterizationparameter,ψJB,estimatesthejunctiontemperatureofadeviceinarealsystemandisextractedfromthesimulationdataforobtainingθJA,usingaproceduredescribedinJESD51-2a(sections6and7). Thejunction-to-case(bottom)thermalresistanceisobtainedbysimulatingacoldplatetestontheexposed(power)pad.NospecificJEDECstandardtestexists,butaclosedescriptioncanbefoundintheANSISEMIstandardG30-88.4SubmitDocumentationFeedbackCopyright©2011–2013,TexasInstrumentsIncorporated ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 www.ti.com SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 ELECTRICALCHARACTERISTICS VDD=VHB=12V,VHS=VSS=0V,noloadonLOorHO,TA=TJ=-40°Cto140°C,(unlessotherwisenoted) PARAMETERSupplyCurrentsIDDIDDOIHBIHBOIHBSIHBSOInputVHITVLITVIHYSRINVHITVLITVIHYSRINVDDRVDDHYSVHBRVHBHYSVFVFIRDVLOLVLOH InputvoltagethresholdInputvoltagethresholdInputvoltagehysteresisInputpulldownresistanceInputvoltagethresholdInputvoltagethresholdInputvoltagehysteresisInputpulldownresistanceVDDturn-onthreshold DDAonly Hysteresis VHBturn-onthreshold DDAonly Hysteresis Low-currentforwardvoltageHigh-currentforwardvoltageDynamicresistance,ΔVF/ΔILow-leveloutputvoltageHighleveloutputvoltagePeakpull-upcurrent(1)Peakpull-downcurrent(1) HOGATEDriverVHOLVHOH Low-leveloutputvoltageHigh-leveloutputvoltagePeakpull-upcurrent(1)Peakpull-downcurrent(1) (1) Ensuredbydesign. IHO=100mA IHO=-100mA,VHOH=VHB-VHOVHO=0VVHO=12V 0.050.1 0.090.163.74.5 0.190.29 VA IVDD-HB=100µAIVDD-HB=100mA IVDD-HB=100mAand80mAILO=100mA ILO=-100mA,VLOH=VDD-VLOVLO=0VVLO=12V 0.30.050.1 BootstrapDiode 0.650.850.50.090.163.74.5 0.80.950.850.190.29 VΩ 5.65.3 UCC27210 UCC27210(DDAonly)UCC27210 UCC27210(DDAonly)UCC27210UCC27211 UCC27211(DDAonly)UCC27211 UCC27211(DDAonly)UCC27211 1.91.91.31.34.24.22.42.4 5.05.03.23.21.81022.32.31.61.670068 6.25.8 7.07.00.56.76.71.1 7.98.07.88.1 V 2.72.81.92.1 mVkΩVkΩ 5.85.94.04.0 V VDDquiescentcurrentVDDoperatingcurrent UCC27210UCC27211 V(LI)=V(HI)=0Vf=500kHz,CLOAD=0V(LI)=V(HI)=0Vf=500kHz,CLOAD=0V(HS)=V(HB)=115Vf=500kHz,CLOAD=0 0.0150.05 0.0852.62.50.0652.50.00050.07 0.175.25.20.15.01.01.2 µAmAmA TESTCONDITION MIN TYP MAX UNITS BootvoltagequiescentcurrentBootvoltageoperatingcurrentHBtoVSSquiescentcurrentHBtoVSSoperatingcurrent Under-VoltageLockout(UVLO) LOGateDriver VA Copyright©2011–2013,TexasInstrumentsIncorporatedSubmitDocumentationFeedback5 ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 www.ti.com ELECTRICALCHARACTERISTICS(continued) VDD=VHB=12V,VHS=VSS=0V,noloadonLOorHO,TA=TJ=-40°Cto140°C,(unlessotherwisenoted) PARAMETER SwitchingParameters:PropagationDelaysTDLFFTDHFFTDLRRTDHRRTDLFFTDHFFTDLRRTDHRR VLIfallingtoVLOfallingVHIfallingtoVHOfallingVLIrisingtoVLOrisingVHIrisingtoVHOrisingVLIfallingtoVLOfallingVHIfallingtoVHOfallingVLIrisingtoVLOrisingVHIrisingtoVHOrising TJ=25°C UCC27210 TMOFFTMONTMOFF FromLOOFFtoHOONFromHOOFFtoLOON UCC27211 FromLOOFFtoHOON TJ=–40°Cto140°CTJ=25°C TJ=–40°Cto140°CTJ=25°C TJ=–40°Cto140°CTJ=25°C TJ=–40°Cto140°CUCC27211,CLOAD=0UCC27210,CLOAD=0 1515151510101010 2121242417171818333322227.27.25.55.50.360.15 0.60.4 µsns 3737464630304040111411149.5149.514 ns TESTCONDITION MIN TYP MAX UNITS SwitchingParameters:DelayMatchingTMON FromHOOFFtoLOON nsnsnsns SwitchingParameters:OutputRiseandFallTimetRtRtFtFtRtF LOrisetimeHOrisetimeLOfalltimeHOfalltimeLO,HOLO,HO Minimuminputpulsewidththatchangestheoutput Bootstrapdiodeturn-offtime (2)(3)(4) (2)(3) CLOAD=1000pF,from10%to90%CLOAD=1000pF,from90%to10%CLOAD=0.1µF,(3Vto9V)CLOAD=0.1µF,(9Vto3V) SwitchingParameters:Miscellaneous 50 IF=20mA,IREV=0.5A (4) ns 20 Ensuredbydesign. IF:Forwardcurrentappliedtobootstrapdiode,IREV:Reversecurrentappliedtobootstrapdiode.TypicalvaluesforTA=25°C. 6SubmitDocumentationFeedbackCopyright©2011–2013,TexasInstrumentsIncorporated ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 www.ti.com SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 TimingDiagrams LI Input(HI,LI) TDLRR,TDHRRHI LO Output(HO,LO)TDLFF,TDHFFHOTMON TMOFF Copyright©2011–2013,TexasInstrumentsIncorporatedSubmitDocumentationFeedback7 ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 www.ti.com DEVICEINFORMATION FunctionalBlockDiagram 2UVLOLEVELSHIFT53HB HOHS 4HI VDD 1UVLO8LOVSS LI 67SOIC-8(D)TOPVIEW PowerPadTMSOIC-8(DDA) TOPVIEW VDD 18LOVDD 1ExposedThermalDiePad8LO HB 27VSSHB 27VSS HO 36LIHO 36LI HS 45HIHS 45HI SON-8(DRM)TOPVIEW VDD1ExposedThermalDiePad*8LO VDDHB 1 SON-10 (DPR)TOPVIEW 10 LOVSSLIHINC HB229 7VSS HO 3 8 HO36LI HS 4 7 HS45HI NC56 8SubmitDocumentationFeedbackCopyright©2011–2013,TexasInstrumentsIncorporated ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 www.ti.com SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 TERMINALFUNCTIONS PINNAMEVDD PIN D/DDA/DRM 1 DPR1 DESCRIPTION Positivesupplytothelower-gatedriver.De-couplethispintoVSS(GND).Typicaldecouplingcapacitorrangeis0.22µFto4.7µF(See(1)). High-sidebootstrapsupply.Thebootstrapdiodeison-chipbuttheexternalbootstrapcapacitorisrequired.Connectpositivesideofthebootstrapcapacitortothispin.TypicalrangeofHBbypasscapacitoris0.022µFto0.1µF.Thecapacitorvalueisdependantonthegatechargeofthehigh-sideMOSFETandshouldalsobeselectedbasedonspeedandripplecriteria High-sideoutput.Connecttothegateofthehigh-sidepowerMOSFET.High-sidesourceconnection.Connecttosourceofhigh-sidepowerMOSFET.Connectthenegativesideofbootstrapcapacitortothispin.High-sideinput.(2)Low-sideinput.(2) Negativesupplyterminalforthedevicewhichisgenerallygrounded.Low-sideoutput.Connecttothegateofthelow-sidepowerMOSFET.NotConnected. UtilizedontheDDA,DRMandDPRpackagesonly.ElectricallyreferencedtoVSS(GND).ConnecttoalargethermalmasstraceorGNDplanetodramaticallyimprovethermalperformance. HB22 HOHSHILIVSSLON/CPowerPAD™(3)(1)(2) 345678-Pad 34789105/6Pad (3) Forcoldtemperatureapplicationswerecommendtheuppercapacitancerange.AttentionshouldalsobemadetoPCBlayout-seeLayoutRecommendations. HIorLIinputisassumedtoconnecttoalowimpedancesourcesignal.Thesourceoutputimpedanceisassumedlessthan100Ω.Ifthesourceimpedanceisgreaterthan100Ω,addabypassingcapacitor,each,betweenHIandVSSandbetweenLIandVSS.Theaddedcapacitorvaluedependsonthenoiselevelspresentedonthepins,typicallyfrom1nFto10nFshouldbeeffectivetoeliminatethepossiblenoiseeffect.Whennoiseispresentontwopins,HIorLI,theeffectistocauseHOandLOmalfunctionstohavewronglogicoutputs. ThePowerPAD™isnotdirectlyconnectedtoanyleadsofthepackage.Howeveritiselectricallyandthermallyconnectedtothesubstratewhichisthegroundofthedevice. Copyright©2011–2013,TexasInstrumentsIncorporatedSubmitDocumentationFeedback9 ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 www.ti.com TYPICALCHARACTERISTICS QUIESCENTCURRENT vs SUPPLYVOLTAGET = 25°C80 IDDO − Operating Current (mA)10 100IDD, IHB − Quiescent Current (µA)100 UCC27210IDDOPERATINGCURRENT vs FREQUENCYUCC27210, VDD = 12V60 1 CL=0pF, T=−40°CCL=0pF, T=25°CCL=0pF, T=140°CCL=1000pF, T=25°CCL=1000pF, T=140°CCL=4700pF, T=140°C10 100 Frequency (kHz) 1000 G002 40 20 UCC27210/1 IDDUCC27210/1 IHB00 2 4 6810121416VDD = VHB − Supply Voltage (V) 18 20 G001 0.1 0.01 Figure1. UCC27211IDDOPERATINGCURRENT vs FREQUENCY UCC27211, VDD = 12VIDDO − Operating Current (mA)10 IHBO − Operating Current (mA)10 Figure2. BOOTVOLTAGEOPERATINGCURRENT vs FREQUENCY(HBtoHS) UCC27210/1, VHB − VHS = 12V100100 1 CL=0pF, T=−40°CCL=0pF, T=25°CCL=0pF, T=140°CCL=1000pF, T=25°CCL=1000pF, T=140°CCL=4700pF, T=140°C10 100 Frequency (kHz) 1000 G003 1 CL=0pF, T=−40°CCL=0pF, T=25°CCL=0pF, T=140°CCL=1000pF, T=25°CCL=1000pF, T=140°CCL=4700pF, T=140°C10 100 Frequency (kHz) 1000 G004 0.10.1 0.010.01 Figure3. UCC27210/11INPUTTHRESHOLD vs SUPPLYVOLTAGE HI, LI − Input Threshold Voltage (V)T = 25°C543210−18UCC27210, RisingUCC27210, FallingUCC27211, RisingUCC27211, Falling1216VDD − Supply Voltage (V) 20G005 Figure4. UCC27210/11INPUTTHRESHOLDS vs TEMPERATURE VDD = 12V543210−1−40−200UCC27210, RisingUCC27210, FallingUCC27211, RisingUCC27211, Falling20406080Temperature (°C) 100120140G006 6 HI, LI − Input Threshold Voltage (V)6 Figure5.Figure6. 10SubmitDocumentationFeedbackCopyright©2011–2013,TexasInstrumentsIncorporated ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 www.ti.com SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 TYPICALCHARACTERISTICS(continued) 0.32VOH − LO/HO Output Voltage (V)0.280.240.20.160.120.080.040−40−200UCC27210/1, VDD=VHB=8VUCC27210/1, VDD=VHB=12VUCC27210/1, VDD=VHB=16VUCC27210/1, VDD=VHB=20V20406080Temperature (°C) 100120140G007 LOANDHOHIGHLEVELOUTPUTVOLTAGE vs TEMPERATURE VOL − LO/HO Output Voltage (V)IHO=ILO= 100mA0.2 LOANDHOLOWLEVELOUTPUTVOLTAGE vs TEMPERATURE IHO=ILO= 100mA0.16 0.12 0.08 UCC27210/1, VDD=VHB=8VUCC27210/1, VDD=VHB=12VUCC27210/1, VDD=VHB=16VUCC27210/1, VDD=VHB=20V−20020406080Temperature (°C) 100120140G008 0.04 0−40Figure7. UNDERVOLTAGELOCKOUTTHRESHOLD vs TEMPERATURE Figure8. UNDERVOLTAGELOCKOUTTHRESHOLDHYSTERESIS vs TEMPERATURE 1.5 87.67.2 1.2Hysteresis (V)VDD Rising ThresholdHB Rising Threshold−20020406080Temperature (°C) 100120140G009 Threshold (V)6.86.465.65.2−400.9 0.6 0.3 VDD UVLO HysteresisHB UVLO Hysteresis0−40−20020406080Temperature (°C) 100120140G010 Figure9. UCC27210PROPAGATIONDELAYS vs TEMPERATURE UCC27210, VDD=VHB=12VPropagation Delay (ns)24 Figure10. UCC27211PROPAGATIONDELAYS vs TEMPERATURE UCC27211, VDD=VHB=12V4036Propagation Delay (ns)322824201612840−4032 16 TDLRRTDLFFTDHRRTDHFF−20020406080Temperature (°C) 100120140G011 8 TDLRRTDLFFTDHRRTDHFF−20020406080Temperature (°C) 100120140G012 0−40Figure11.Figure12. Copyright©2011–2013,TexasInstrumentsIncorporatedSubmitDocumentationFeedback11 ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 www.ti.com TYPICALCHARACTERISTICS(continued) 3228Propagation Delay (ns)2420161284081216VDD=VHB − Supply Voltage (V) TDLRRTDLFFTDHRRTDHFF20G012 UCC27210PROPAGATIONDELAYS vs SUPPLYVOLTAGE UCC27210, T=25°CPropagation Delay (ns)3228242016128408UCC27211PROPAGATIONDELAYS vs SUPPLYVOLTAGE UCC27211, T=25°CTDLRRTDLFFTDHRRTDHFF1216VDD=VHB − Supply Voltage (V) 20G014 Figure13.DELAYMATCHING vs TEMPERATURE VDD=VHB=12VILO, IHO − Output Current (A)8 Delay Matching (ns)6420−2−40UCC27210, TMonUCC27210, TMoffUCC27211, TMonUCC27211, TMoff−20020406080Temperature (°C) 100120140G015 Figure14.OUTPUTCURRENT vs OUTPUTVOLTAGE VDD=VHB=12V4 105 3 2 1 Pull Down CurrentPull Up Current02468VLO, VHO − Output Voltage (V) 1012G016 0 Figure15.DIODECURRENT vs DIODEVOLTAGE Figure16. 100 NEGATIVE10-VINPUT 10Diode Current (mA)1 0.1 0.01 0.001 500 550600 650700750Diode Voltage (mV) 800850 G017 Figure17.Figure18. 12SubmitDocumentationFeedbackCopyright©2011–2013,TexasInstrumentsIncorporated ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 www.ti.com SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 TYPICALCHARACTERISTICS(continued) STEPINPUT SYMMETRICALUVLO Figure19.Figure20. Copyright©2011–2013,TexasInstrumentsIncorporatedSubmitDocumentationFeedback13 ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 www.ti.com APPLICATIONINFORMATION FunctionalDescription TheUCC27210/11representTexasInstruments’latestgenerationofhighvoltagegatedriverswhicharedesignedtodriveboththehigh-sideandlow-sideofN-ChannelMOSFETsinahalf-/full-bridgeorsynchronousbuckconfiguration.Thefloatinghigh-sidedriveriscapableofoperatingwithsupplyvoltagesofupto120V.ThisallowsforN-ChannelMOSFETcontrolinhalf-bridge,full-bridge,pushpull,two-switchforwardandactiveclampforwardconverters. TheUCC27210/11feature4-Asource/sinkcapability,industrybest-in-classswitchingcharacteristicsandahostofotherfeatureslistedinthetablebelow.Thesefeaturescombinetoensureefficient,robustandreliableoperationinhigh-frequencyswitchingpowercircuits. Table1.UCC27210/11Highlights FEATURE 4-Asourceandsinkcurrentwith0.9-ΩoutputresistanceInputpins(HIandLI)candirectlyhandle-10VDCupto20VDC120-Vinternalbootdiode Switchnode(HSpin)abletohandle-18Vmaximumfor100nsRobustESDcircuitrytohandlevoltagespikes 18-nspropagationdelaywith7.2-ns/5.5-nsrise/fallTimes2-ns(typ)delaymatchingbetweenchannelsSymmetricalUVLOcircuit CMOSoptimizedthresholdorTTLoptimizedthresholdswithincreasedhysteresis BENEFIT HighpeakcurrentidealfordrivinglargepowerMOSFETswithminimalpowerloss(fast-drivecapabilityatMillerplateau)Increasedrobustnessandabilitytohandleunder/overshoot.Caninterfacedirectlytogate-drivetransformerswithouthavingtouserectificationdiodes Providesvoltagemargintomeettelecom100-VsurgerequirementsAllowsthehigh-sidechanneltohaveextraprotectionfrominherentnegativevoltagescausedparasiticinductanceandstraycapacitance. ExcellentimmunitytolargedV/dTconditions Best-in-classswitchingcharacteristicsandextremelylow-pulsetransmissiondistortion Avoidstransformervolt-secondoffsetinbridge Ensureshigh-sideandlow-sideshutdownatthesametimeComplementarytoanalogordigitalPWMcontrollers.Increasedhysteresisoffersaddednoiseimmunity InUCC27210/11,thehighsideandlowsideeachhaveindependentinputswhichallowmaximumflexibilityofinputcontrolsignalsintheapplication.Thebootdiodeforthehigh-sidedriverbiassupplyisinternaltotheUCC27210andUCC27211.TheUCC27210isthePseudo-CMOScompatibleinputversionandtheUCC27211istheTTLorlogiccompatibleversion.Thehigh-sidedriverisreferencedtotheswitchnode(HS)whichistypicallythesourcepinofthehigh-sideMOSFETanddrainpinofthelow-sideMOSFET.Thelow-sidedriverisreferencedtoVSSwhichistypicallyground.Thefunctionscontainedaretheinputstages,UVLOprotection,levelshift,bootdiode,andoutputdriverstages. 14SubmitDocumentationFeedbackCopyright©2011–2013,TexasInstrumentsIncorporated ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 www.ti.com SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 InputStages TheinputstagesprovidetheinterfacetothePWMoutputsignals.TheinputimpedanceoftheUCC27210is100kΩnominalandinputcapacitanceisapproximately2pF.The100kΩisapull-downresistancetoVSS(ground).TheUCC27210Pseudo-CMOSinputstructurehasbeendesignedtoprovidelargehysteresisandatthesametimetoallowsinterfacingtoamultitudeofanalogordigitalPWMcontrollers.InsomeCMOSdesigns,theinputthresholdsaredeterminedasapercentageofVDD.Bydoingso,thehigh-levelinputthresholdcanbecomeunreasonablyhighandunusable.TheUCC27210recognizesthefactthatVDDlevelsaretrendingdownwardanditthereforeprovidesarisingthresholdwith5.0V(typ)andfallingthresholdwith3.2V(typ).TheinputhysteresisoftheUCC27210is1.8V(typ). TheinputstagesoftheUCC27211haveimpedanceof70kΩnominalandinputcapacitanceisapproximately2pF.Pull-downresistancetoVSS(ground)is70kΩ.Thelogiclevelcompatibleinputprovidesarisingthresholdof2.3Vandafallingthresholdof1.6V. UnderVoltageLockout(UVLO) Thebiassuppliesforthehigh-sideandlow-sidedrivershaveUVLOprotection.VDDaswellasVHBtoVHSdifferentialvoltagesaremonitored.TheVDDUVLOdisablesbothdriverswhenVDDisbelowthespecifiedthreshold.TherisingVDDthresholdis7.0Vwith0.5-Vhysteresis.TheVHBUVLOdisablesonlythehigh-sidedriverwhentheVHBtoVHSdifferentialvoltageisbelowthespecifiedthreshold.TheVHBUVLOrisingthresholdis6.7Vwith1.1-Vhysteresis. LevelShift Thelevelshiftcircuitistheinterfacefromthehigh-sideinputtothehigh-sidedriverstagewhichisreferencedtotheswitchnode(HS).ThelevelshiftallowscontroloftheHOoutputreferencedtotheHSpinandprovidesexcellentdelaymatchingwiththelow-sidedriver. BootDiode Thebootdiodenecessarytogeneratethehigh-sidebiasisincludedintheUCC27210/11familyofdrivers.ThediodeanodeisconnectedtoVDDandcathodeconnectedtoVHB.WiththeVHBcapacitorconnectedtoHBandtheHSpins,theVHBcapacitorchargeisrefreshedeveryswitchingcyclewhenHStransitionstoground.Thebootdiodeprovidesfastrecoverytimes,lowdioderesistance,andvoltageratingmargintoallowforefficientandreliableoperation. OutputStages TheoutputstagesaretheinterfacetothepowerMOSFETsinthepowertrain.Highslewrate,lowresistanceandhighpeakcurrentcapabilityofbothoutputdriversallowforefficientswitchingofthepowerMOSFETs.Thelow-sideoutputstageisreferencedfromVDDtoVSSandthehighsideisreferencedfromVHBtoVHS. Copyright©2011–2013,TexasInstrumentsIncorporatedSubmitDocumentationFeedback15 ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 www.ti.com LayoutRecommendations Toimprovetheswitchingcharacteristicsandefficiencyofadesign,thefollowinglayoutrulesshouldbefollowed.•LocatethedriverascloseaspossibletotheMOSFETs. •LocatetheVDD-VSSandVHB-VHS(bootstrap)capacitorsascloseaspossibletothedevice(seeexamplelayoutbelow). •PaycloseattentiontotheGNDtrace.UsethethermalpadoftheDDAandDRMpackageasGNDbyconnectingittotheVSSpin(GND).TheGNDtracefromthedrivergoesdirectlytothesourceoftheMOSFETbutshouldnotbeinthehighcurrentpathoftheMOSFET(S)drainorsourcecurrent.•UsesimilarrulesfortheHSnodeasforGNDforthehigh-sidedriver. •ForsystemsusingmultipleUCC27210andUCC27211deviceswerecommendthatdedicateddecouplingcapacitorsbelocatedatVDD-VSSforeachdevice. •CareshouldbetakentoavoidVDDtracesbeingclosetoLO,HS,andHOsignals. •UsewidetracesforLOandHOcloselyfollowingtheassociatedGNDorHStraces.60to100-milswidthispreferablewherepossible. •UseasleasttwoormoreviasifthedriveroutputsorSWnodeneedstoberoutedfromonelayertoanother.ForGNDthenumberofviasneedstobeaconsiderationofthethermalpadrequirementsaswellasparasiticinductance. •AvoidLIandHI(driverinput)goingclosetotheHSnodeoranyotherhighdV/dTtracesthatcaninducesignificantnoiseintotherelativelyhighimpedanceleads.KeepinmindthatapoorlayoutcancauseasignificantdropinefficiencyorsystemmalfunctionversusagoodPCBlayoutandcanevenleadtodecreasedreliabilityofthewholesystem. ExampleComponentPlacementFigure21.UCC27210/11ComponentPlacementAdditionalReferences Thesereferencesandlinkstoadditionalinformationmaybefoundatwww.ti.com •AdditionallayoutguidelinesforPCBlandpatternsmaybefoundin,QFN/SONPCBAttachment,ApplicationBrief(TexasInstrument'sLiteratureNumberSLUA271) •Additionalthermalperformanceguidelinesmaybefoundin,PowerPAD™ThermallyEnhancedPackageApplicationReport,ApplicationReport(TexasInstrument'sLiteratureNumberSLMA002A) •Additionalthermalperformanceguidelinesmaybefoundin,PowerPAD™MadeEasy,ApplicationReport(TexasInstrument'sLiteratureNumberSLMA004) 16SubmitDocumentationFeedbackCopyright©2011–2013,TexasInstrumentsIncorporated ProductFolderLinks:UCC27210UCC27211 UCC27210UCC27211 www.ti.com SLUSAT7E–NOVEMBER2011–REVISEDAUGUST2013 REVISIONHISTORY ChangesfromRevisionA(November,2011)toRevisionB• Page Changedorderinginformationnotestoreflectcorrectedpartnumber.................................................................................2 Page ChangesfromRevisionB(February)toRevisionC•••••••••••••• ChangedVDDoperatingcurrentmaxrangeof4.3to4.4inbothplaces..............................................................................5ChangedBootvoltageoperatingcurrentmaxrangefrom4.0to4.2...................................................................................5ChangedHBtoVSSquiescentcurrentmaxrangefrom0.13to1.0.....................................................................................5ChangedHBtoVSSoperatingcurrentmaxrangefrom0.9to1.1........................................................................................5AddedInputUCC27210/11(DDAOnly)values....................................................................................................................5AddedUnder-VoltageLockout(UVLO)DDAonlyvalues,twoplaces.................................................................................5ChangedLOGateDriver'sLow-leveloutputvoltagemaxrangefrom0.15to0.17.............................................................5ChangedLOGateDriver'sVLOHmaxrangefrom0.27to0.29............................................................................................5ChangedHOGATEDriver'sLow-leveloutputvoltagemaxrangefrom0.15to0.17..........................................................5ChangedVLIfallingtoVLOfallingminvaluefrom17to15...................................................................................................6ChangedVHIfallingtoVHOfallingminvaluefrom17to15..................................................................................................6ChangedVLIrisingtoVLOrisingminvaluefrom18to15.....................................................................................................6ChangedVHIrisingtoVHOrisingminvaluefrom18to15....................................................................................................6ChangedFigure17,OutputCurrentvs.OutputVoltage....................................................................................................12 Page ChangesfromRevisionC(March,2012)toRevisionD••••• Changedcapacitorrangefrom1.0µFto4.7µF..................................................................................................................9AddedTerminalFunctionsNotetoHIandLIpindescription...............................................................................................9Changedbullet2intheLayoutRecommendations............................................................................................................16AddedNote:Forsystemsusing..........................................................................................................................................16AddedNote:Careshouldbetaken....................................................................................................................................16 Page ChangesfromRevisionC(November,2012)toRevisionE••••••••••• ChangedRepetitivepulsedatafrom-18Vto-(24V-VDD)...................................................................................................3AddedadditionaldetailstoNote2........................................................................................................................................3ChangedVoltageonHS,VHS(repetitivepulse<100ns)datafrom-15to-(24V-VDD).......................................................3Deleted2.4-mAoperatingcurrentminrangeinbothplaces................................................................................................5Changedoperatingcurrentmaxrangeextendedto5.2inbothplaces...............................................................................5Deleted1.5minBootvoltageoperatingcurrentrange.........................................................................................................5ChangedBootvoltageoperatingcurrentmaxrangefrom4.2to5.0...................................................................................5ChangedHBtoVSSoperatingcurrentmaxrangefrom1.1to1.2........................................................................................5ChangedLOGateDriver'sLow-leveloutputvoltagemaxrangefrom0.17to0.19.............................................................5ChangedHOGATEDriver'sLow-leveloutputvoltagemaxrangefrom0.17to0.19..........................................................5AddedNote2totheTerminalFunctionsTable....................................................................................................................9 Copyright©2011–2013,TexasInstrumentsIncorporatedSubmitDocumentationFeedback17 ProductFolderLinks:UCC27210UCC27211 PACKAGE OPTION ADDENDUM www.ti.com 26-Aug PACKAGING INFORMATION Orderable DeviceUCC27210DUCC27210DDAUCC27210DDARUCC27210DPRRUCC27210DPRTUCC27210DRUCC27210DRMRUCC27210DRMTUCC27211DUCC27211DDAUCC27211DDARUCC27211DPRRUCC27211DPRTUCC27211DRUCC27211DRMRUCC27211DRMT (1) Status(1)Package TypePackagePinsPackageDrawingQtySOICDDDADDADPRDPRDDRMDRMDDDADDADPRDPRDDRMDRM888101088888810108887575250030002502500300025075752500300025025003000250Eco Plan(2)Lead/Ball FinishCU NIPDAUMSL Peak Temp(3)Op Temp (°C)-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140-40 to 140Device Marking(4/5)SamplesACTIVEGreen (RoHS& no Sb/Br)Level-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-2-260C-1 YEARLevel-2-260C-1 YEARLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-2-260C-1 YEARLevel-2-260C-1 YEARLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIM272102721027210UCC27210UCC27210272102721027210272112721127211UCC27211UCC27211272112721127211ACTIVESO PowerPADACTIVESO PowerPADACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEWSONWSONSOICVSONVSONSOICGreen (RoHSCU NIPDAUAG& no Sb/Br)Green (RoHSCU NIPDAUAG& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)CU NIPDAUCU NIPDAUCU NIPDAUCU NIPDAUCU NIPDAUCU NIPDAUACTIVESO PowerPADACTIVESO PowerPADACTIVEACTIVEACTIVEACTIVEACTIVEWSONWSONSOICVSONVSONGreen (RoHSCU NIPDAUAG& no Sb/Br)Green (RoHSCU NIPDAUAG& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)CU NIPDAUCU NIPDAUCU NIPDAUCU NIPDAUCU NIPDAU The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 26-Aug-2013 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms \"Lead-Free\" or \"Pb-Free\" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines \"Green\" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (4) (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a \"~\" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGEMATERIALSINFORMATION www.ti.com 23-Aug-2013 TAPEANDREELINFORMATION *Alldimensionsarenominal Device PackagePackagePinsTypeDrawingSOPower PADWSONWSONSOICVSONVSONSOPower PADWSONWSONSOICVSONVSON DDA 8 SPQ ReelReelA0DiameterWidth(mm)(mm)W1(mm)330.0 12.8 6.4 B0(mm)5.2 K0(mm)2.1 P1(mm)8.0 WPin1(mm)Quadrant12.0 Q1 UCC27210DDAR2500 UCC27210DPRRUCC27210DPRTUCC27210DRUCC27210DRMRUCC27210DRMTUCC27211DDAR DPRDPRDDRMDRMDDA 10108888 3000250250030002502500 330.0180.0330.0330.0180.0330.0 12.412.412.412.412.412.8 4.254.256.44.254.256.4 4.254.255.24.254.255.2 1.151.152.11.151.152.1 8.08.08.08.08.08.0 12.012.012.012.012.012.0 Q2Q2Q1Q2Q2Q1 UCC27211DPRRUCC27211DPRTUCC27211DRUCC27211DRMRUCC27211DRMT DPRDPRDDRMDRM 1010888 300025025003000250 330.0180.0330.0330.0180.0 12.412.412.412.412.4 4.254.256.44.254.25 4.254.255.24.254.25 1.151.152.11.151.15 8.08.08.08.08.0 12.012.012.012.012.0 Q2Q2Q1Q2Q2 PackMaterials-Page1 PACKAGEMATERIALSINFORMATION www.ti.com 23-Aug-2013 *Alldimensionsarenominal DeviceUCC27210DDARUCC27210DPRRUCC27210DPRTUCC27210DRUCC27210DRMRUCC27210DRMTUCC27211DDARUCC27211DPRRUCC27211DPRTUCC27211DRUCC27211DRMRUCC27211DRMT PackageTypeSOPowerPAD WSONWSONSOICVSONVSONSOPowerPAD WSONWSONSOICVSONVSON PackageDrawing DDADPRDPRDDRMDRMDDADPRDPRDDRMDRM Pins8101088881010888 SPQ25003000250250030002502500300025025003000250 Length(mm) 366.0367.0210.0367.0367.0210.0366.0367.0210.0367.0367.0210.0 Width(mm)364.0367.0185.0367.0367.0185.0364.0367.0185.0367.0367.0185.0 Height(mm) 50.035.035.035.035.035.050.035.035.035.035.035.0 PackMaterials-Page2 IMPORTANTNOTICE TexasInstrumentsIncorporatedanditssubsidiaries(TI)reservetherighttomakecorrections,enhancements,improvementsandotherchangestoitssemiconductorproductsandservicesperJESD46,latestissue,andtodiscontinueanyproductorserviceperJESD48,latestissue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete.Allsemiconductorproducts(alsoreferredtohereinas“components”)aresoldsubjecttoTI’stermsandconditionsofsalesuppliedatthetimeoforderacknowledgment. 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TIhasspecificallydesignatedcertaincomponentsasmeetingISO/TS16949requirements,mainlyforautomotiveuse.Inanycaseofuseofnon-designatedproducts,TIwillnotberesponsibleforanyfailuretomeetISO/TS16949.ProductsAudioAmplifiersDataConvertersDLP®ProductsDSP ClocksandTimersInterfaceLogicPowerMgmtMicrocontrollersRFID OMAPApplicationsProcessorsWirelessConnectivity www.ti.com/audioamplifier.ti.comdataconverter.ti.comwww.dlp.comdsp.ti.comwww.ti.com/clocksinterface.ti.comlogic.ti.compower.ti.commicrocontroller.ti.comwww.ti-rfid.comwww.ti.com/omap TIE2ECommunity e2e.ti.com www.ti.com/wirelessconnectivity MailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265 Copyright©2014,TexasInstrumentsIncorporated Applications AutomotiveandTransportationCommunicationsandTelecomComputersandPeripheralsConsumerElectronicsEnergyandLightingIndustrialMedicalSecurity Space,AvionicsandDefenseVideoandImaging www.ti.com/automotivewww.ti.com/communicationswww.ti.com/computerswww.ti.com/consumer-appswww.ti.com/energywww.ti.com/industrialwww.ti.com/medicalwww.ti.com/security www.ti.com/space-avionics-defensewww.ti.com/video 因篇幅问题不能全部显示，请点此查看更多更全内容