专利名称:Structure Model description and use for
scatterometry-based semiconductormanufacturing process metrology
发明人:Michael Kotelyanskii,Xueping Ru,Robert G.
Wolf,Yue Yang
申请号:US12227387申请日:20070514
公开号:US20090306941A1公开日:20091210
专利附图:
摘要:A method includes accessing a structure model defining a cross-sectional
profile of a structure on a sample. The cross-sectional profile is at least partially definedusing a set of blocks. Each of the blocks includes a number of vertices. One or more ofthe vertices are expressed using one or more algebraic relationships between a numberof parameters corresponding to the structure. Information is evaluated from thestructure model to produce expected metrology data for a scatterometry-based opticalmetrology. The expected metrology data is suitable for use for determining one or moreof the number of parameters corresponding to the structure. Apparatus are alsodisclosed.
申请人:Michael Kotelyanskii,Xueping Ru,Robert G. Wolf,Yue Yang
地址:Chatham NJ US,Washington NJ US,Hackettstown NJ US,Millburn NJ US
国籍:US,US,US,US
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