INDUCTIVE INERTIAL SENSOR ARCHITECTURE & FABRI

专利名称：INDUCTIVE INERTIAL SENSOR

ARCHITECTURE & FABRICATION INPACKAGING BUILD-UP LAYERS

发明人：Qing MA,Feras EID,Kevin LIN,Johanna M.

SWAN,Weng Hong TEH,Valluri R. RAO

申请号：US13720876申请日：20121219

公开号：US20140165723A1公开日：20140619

专利附图：

摘要：This invention relates to inductive inertial sensors employing a magnetic drive

and/or sense architecture. In embodiments, translational gyroscopes utilize a conductivecoil made to vibrate in a first dimension as a function of a time varying current driventhrough the coil in the presence of a magnetic field. Sense coils register an inductancethat varies as a function of an angular velocity in a second dimension. In embodiments,the vibrating coil causes first and second mutual inductances in the sense coils to deviatefrom each other as a function of the angular velocity. In embodiments, self-inductancesassociated with a pair of meandering coils vary as a function of an angular velocity in asecond dimension. In embodiments, package build-up layers are utilized to fabricate theinductive inertial sensors, enabling package-level integrated inertial sensingadvantageous in small form factor computing platforms, such as mobile devices.

申请人：Qing MA,Feras EID,Kevin LIN,Johanna M. SWAN,Weng Hong TEH,Valluri R. RAO

地址：Saratoga CA US,Chandler AZ US,Beaverton OR US,Scottsdale AZ US,Phoenix AZUS,Saratoga CA US

国籍：US,US,US,US,US,US

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