PROBE ASSEMBLY AND METHOD FOR CONTACTLESS ELECTRIC

专利名称：PROBE ASSEMBLY AND METHOD FOR

CONTACTLESS ELECTRICALCHARACTERIZATION OF BURIEDCONDUCTING LAYERS

发明人：Matthew Grayson,Wang Zhou,Gautham Badri

Ramachandran Sundar

申请号：US14382599申请日：20130306

公开号：US20150022223A1公开日：20150122

专利附图：

摘要：A probe assembly includes plural capacitive contacts that are separate fromeach other and a conductive depletion gate disposed between and separating thecontacts from each other. The depletion gate is configured to receive a direct electricvoltage in order to deplete regions of a sample under test of electrons. The contacts areconfigured to be placed in close proximity to a buried conducting layer in the sampleunder test without engaging the buried conducting layer, thereby capacitively couplingto the buried conducting layer. A first subset of the capacitive contacts is configured toapply an alternating electric current to a portion of the sample under test and a secondsubset of the capacitive contacts is configured to sense an alternating voltage responseof the portion of the sample under test in order to characterize one or more electricalproperties of the sample under test without the capacitive contacts having ohmic contactwith the buried conducting layer.

申请人：Northwestern University

地址：Evanston IL US

国籍：US

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