专利名称：INTEGRATED CIRCUIT MASTERSLICE发明人：HENDERSON, Richard, C.申请号：EP87905678.0申请日：19870720公开号：EP0281590A1公开日：19880914
摘要： In the standardized wafer (2) in integrated circuits, a plurality of mutuallyspaced epitaxial columns (4) are formed on an insulating substrate (6). Each column (4)has successive pairs of field effect transistors FETs n channels (10) alternating withsuccessive pairs of TECs to p channel (8), whose contacts are accessible by a surfacemetallization. drain contacts and source (12, 16, 20, 24) are shared by adjacent TECs, andcorresponding elements in adjacent columns are arranged in rows. The standardizedwafer (2) accepts a wide variety of circuits with a metallization interconnect and highdensity transistor gate.
申请人：HUGHES AIRCRAFT COMPANY
地址：7200 Hughes Terrace Los Angeles, California 90502 US
国籍：US
代理机构：KUHNEN, WACKER & PARTNER
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