专利名称：COMPONENT MOUNTING DEVICE发明人：Kazushi TAKAMA申请号：US15759476申请日：20151014
公开号：US20180263150A1公开日：20180913
专利附图：
摘要：A component mounting device includes a mounting portion that mounts acomponent on a bonding material disposed on a substrate, and a measurement unit thatmeasures a state of the bonding material at least after an operation of mounting thecomponent performed by the mounting portion. The component mounting device
further includes a control unit that verifies the state of the bonding material based on ameasurement result obtained by the measurement unit when defective mounting of thecomponent has occurred.
申请人：YAMAHA HATSUDOKI KABUSHIKI KAISHA
地址：Iwata-shi, Shizuoka-ken JP
国籍：JP
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