Semiconductor device leadframe

专利名称：Semiconductor device leadframe

发明人：Van Straten, Freek, Egbert,Incomio, Jeremy

Joy, Montalbo,Reijs, Albertus

申请号：EP13186182.5申请日：20130926公开号：EP28162A1公开日：20150401

专利附图：

摘要：For so called film assisted moulding (FAM) device processing techniques there isprovided lead frame for a semiconductor device, comprising a base portion and aconnection lead, said base portion arranged for mounting a semiconductor die, said

connection lead comprising a horizontal portion for external connection and an angledportion for connection to said semiconductor die, wherein the angled portion has apositive angle with respect to the base portion. The connection lead may comprise arecessed portion.

申请人：NXP B.V.

地址：High Tech Campus 60 5656 AG Eindhoven NL

国籍：NL

代理机构：Crawford, Andrew

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