ALIGNMENT PRECISION ENHANCEMENT OF ELECTRONIC COMP

专利名称：ALIGNMENT PRECISION ENHANCEMENT OF

ELECTRONIC COMPONENT PROCESS ONFLEXIBLE SUBSTRATE DEVICE AND METHODTHEREOF THE SAME

发明人：Jia-Chong Ho,Tarng-Shiang Hu,Hsiang-Yuan

Cheng

申请号：US12241591申请日：20080930

公开号：US20090026678A1公开日：20090129

专利附图：

摘要：Alignment precision enhancement of electronic component process on flexiblesubstrate device and method thereof the same is proposed. The process step of aflexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by apolymer tape. A plural of alignment marks is making for lithography process. Anunstressed cut is separated the flexible substrate and substrate holder when theelectronic component is made.

申请人：Jia-Chong Ho,Tarng-Shiang Hu,Hsiang-Yuan Cheng

地址：Ying Ko Jen TW,Hsin Chu City TW,Taipei City TW

国籍：TW,TW,TW

更多信息请下载全文后查看