专利名称：Alignment in the Packaging of Integrated
Circuits
发明人：Kuei-Wei Huang,Chih-Wei Lin,Wei-Hung
Lin,Ming-Da Cheng,Chung-Shi Liu
申请号：US15143957申请日：20160502
公开号：US20160247790A1公开日：20160825
专利附图：
摘要：A method includes aligning a top package to a bottom package using analignment mark in the bottom package, and placing the top package over the bottom
package, wherein the top package is aligned to the bottom package after the placing thetop package over the bottom package. A reflow is then performed to bond the toppackage to the bottom package.
申请人：Taiwan Semiconductor Manufacturing Company, Ltd.
地址：Hsin-Chu TW
国籍：TW
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