Solder bonding method and solder joint

专利名称：Solder bonding method and solder joint发明人：稲葉 耕,竹政 哲,小菅 正申请号：JP2018562731申请日：20180119

公开号：JPWO2018134673A1公开日：20191107

专利附图：

摘要：Problem to be solved: to provide a solder method for reducing thermaldamage of electronic components and forming solder joints having excellent connectionreliability and joining electrodes of the substrate and electrodes of the electroniccomponents.A solder joint method for bonding the electrodes of the substrate and theelectrode of the electronic component by forming a solder joint, and a Sn Bi solder alloyhaving a melting point lower than that of the solder alloy formed on the electrode of theelectronic component is formed on the electrode of the substrate.Further, the electronicparts are mounted on the substrate so that the solder alloy formed on the electrode ofthe substrate and the solder alloy formed on the electrode of the electronic component

are in contact with each other.Further, the peak heating temperature is set to 150 to 180° C., and the substrate is heated with a peak heating temperature of 60 seconds to 150seconds or less.The cooling rate after heating is set to 3 ° C. or more seconds to cool thesubstrate to form a solder joint.

申请人：レノボ・シンガポール・プライベート・リミテッド

地址：シンガポール ５５６７４１、ニュウテックパーク、＃０２－０１、ローロンチュアン １５１

国籍：SG

代理人：剱物 英貴

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