Apparatus and method for improving uniformity in e

专利名称：Apparatus and method for improving

uniformity in electroplating

发明人：Hooman Hafezi,Aron Rosenfeld申请号：US11362433申请日：20060224

公开号：US20060201814A1公开日：20060914

专利附图：

摘要：A method and apparatus for plating a metal onto a substrate. One embodimentof the present invention provides an apparatus for electroplating a substrate. Theapparatus comprises a fluid basin, an anode disposed near a bottom of the fluid basin, a

restrictor disposed above the anode, and a substrate support member configured tomove the substrate within the fluid basin among different elevations relative to therestrictor. Plating profiles on the substrate may be adjusted by changing the elevation ofthe substrate during plating.

申请人：Hooman Hafezi,Aron Rosenfeld

地址：Redwood City CA US,Palo Alto CA US

国籍：US,US

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