Method and apparatus for slicing workpiece

专利名称：Method and apparatus for slicing workpiece发明人：Itoi, Kirio申请号：EP96301978.1申请日：19960322公开号：EP0734823A1公开日：19961002

专利附图：

摘要：Disclosed are an improved method and apparatus for slicing a workpiece 21such as a semiconductor ingot, in which coolant nozzles 2, 3 are disposed near the cuttingedge la of an annular blade 1, air nozzles 4, 5 are respectively equipped near the bothside surfaces A, B, the air nozzles 4, 5 are connected to a compressed air supply source

10 via pressure regulators 6, 7 and electromagnetic valves 8, 9, a deflection detector 11 islocated in the vicinity of one of the side surfaces A, B, which detector 11 is connected tothe air nozzles 4, 5 via a computer 13 and the pressure regulators 6, 7, wherein, in thecourse of slicing, for example, if an actual deflection has been detected toward one ofthe side surfaces A, B, the compressed air is blown from an adjacent air nozzle 4, 5 to theone of the side surfaces A, B and the secondary pressure of the pressure regulatorconnecting to the adjacent air nozzle 4, 5 is regulated higher or lower, as the blade 1 isdeflected larger or smaller. In such a manner, deflection of the blade 1 is minimized todecrease a warpage of a sliced wafer obtained by the annular saw blade method andapparatus.

申请人：SHIN-ETSU HANDOTAI COMPANY LIMITED

地址：4-2, Marunouchi 1-Chome Chiyoda-ku Tokyo JP

国籍：JP

代理机构：Cooper, John

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