Reflow oven

专利名称：Reflow oven

发明人：Motomu Shibamura,Atsushi Tanaka申请号：US11476874申请日：20060629

公开号：US20070042313A1公开日：20070222

专利附图：

摘要：In the first buffering area provided between the inlet of the furnace and theheating chamber, the ambient gas is blown to the printed circuit board from the lowerside of the carrier device, while the ambient gas is sucked in the upper side of the carrierdevice, thus the outside air is prevented from infiltrating and the ambient gas is

prevented from flowing out. Furthermore, the flux is prevented from being attached tothe printed circuit board, by installing the flux dropping prevention mechanism in thesuction port of the ambient gas.

申请人：Motomu Shibamura,Atsushi Tanaka

地址：Tokyo JP,Tokyo JP

国籍：JP,JP

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