INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE DIES AND

专利名称：INTEGRATED CIRCUIT PACKAGE WITH

MULTIPLE DIES AND QUEUE ALLOCATION

发明人：Andrew Michael Jones,Stuart Ryan申请号：US12958744申请日：20101202

公开号：US20110133826A1公开日：20110609

专利附图：

摘要：A package includes a first die and a second die. The dies are connected to eachother through an interface. At least one of the first and second dies includes a pluralityof signal sources, wherein each source has at least one quality of service parameter

associated therewith, and a plurality of queues having a different priorities. A signal froma respective one of the signal sources is allocated to one of the plurality of queues independence on the at least one quality of service parameter associated with therespective signal source. The interface is configured such that signals from said queuesare transported from one of said first and second dies to the other of said first andsecond dies.

申请人：Andrew Michael Jones,Stuart Ryan

地址：Bristol GB,Bristol GB

国籍：GB,GB

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