专利名称：Thermoplastic molding composition
comprising microencapsulated latent-heat-accumulator material
发明人：Stephan Altmann,Dirk Opfermann,Tina
Schroeder-Grimonpont,Marco Schmidt
申请号：US13988419申请日：20111121公开号：US08957122B2公开日：20150217
摘要：A thermoplastic molding composition is provided, which comprises A) from 30to 90% by weight of at least one thermoplastic polymer, B) from 10 to 70% by weight ofmicrocapsules with a capsule core made of latent-heat-accumulator material and apolymer as capsule wall, where the latent-heat-accumulator material has its solid/liquidphase transition in the temperature range from −20° C. to 120° C., and C) from 0 to 60%by weight of one or more further additive, where each of the percentages by weight isbased on the total weight of components A) to C) and these give a total of 100% byweight, obtainable via mixing in the melt of components A), B), and optionally C) in amultiscrew extruder, where the multiscrew extruder comprises, along the direction ofconveying, in this sequence, at least one feed zone, one plastifying zone, one
homogenizing zone, and one discharge zone, and the feed of the microcapsules B) intothe multiscrew extruder takes place at a site after—in the direction of conveying—theplastifying zone. And also a process for producing the composition and uses of thecomposition for producing fibers, foils, moldings, and foams are provided.
申请人：Stephan Altmann,Dirk Opfermann,Tina Schroeder-Grimonpont,Marco Schmidt
地址：Ruppertsberg DE,Mannheim DE,Rheinzabern DE,Speyer DE
国籍：DE,DE,DE,DE
代理机构：Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
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