专利名称：Post-termination process for thick-film
resistors of printed-circuit boards
发明人：Palanisamy, Ponnusamy申请号：EP89308931.8申请日：19890904公开号：EP0364095A2公开日：19900418
专利附图：
摘要：A printed circuit board (10) includes both high and low resistive value thick filmresistors interconnected by a copper film (18). To lower the contact resistance to thethick film resistors (12) of high value, each is provided at its ends with a termination(16A,16B) of a composition similar to that used for the low value resistors (16). Thisprovides a relatively low-resistance contact region which overcomes the difficulty that acopper thick film conductor has in making electrical connections to compositionsgenerally used for making high value thick film resistors. The compositions of high andlow resistivities are adapted to permit firing of both compositions in a single firing step.
申请人：DELCO ELECTRONICS CORPORATION (a Delaware corp.)
地址：700 East Firmin Street Kokomo, Indiana 46902 US
国籍：US
代理机构：Denton, Michael John
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