ADHESIVE FILM FOR SEMICONDUCTOR, COMPOSITE SHEET,

专利名称：ADHESIVE FILM FOR SEMICONDUCTOR,

COMPOSITE SHEET, AND METHOD FORPRODUCING SEMICONDUCTOR CHIP USINGTHEM

发明人：NAKAMURA, YUUKI,KITAKATSU,

TSUTOMU,KATAYAMA,YOUJI,HATAKEYAMA, KEIICHI

申请号：EP08739473申请日：20080331公开号：EP2139027A4公开日：20120808

摘要：There is provided an adhesive film for a semiconductor, which can be attachedto a semiconductor wafer at low temperature and which allows semiconductor chips tobe obtained at high yield from the semiconductor wafer while sufficiently inhibitinggeneration of chip cracks and burrs. The adhesive film for a semiconductor comprises apolyimide resin that can be obtained by reaction between a tetracarboxylic dianhydridecontaining 4,4'-oxydiphthalic dianhydride represented by chemical formula (I) below anda diamine containing a siloxanediamine represented by the following general formula (II)below, and that can be attached to a semiconductor wafer at 100°C or below.

申请人：HITACHI CHEMICAL COMPANY, LTD.

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