Method of producing semiconductor wafer

专利名称：Method of producing semiconductor wafer发明人：Yoichi Togashi申请号：US08/578027申请日：19951226公开号：US057453A公开日：19980428

摘要：A system for producing a semiconductor wafer includes a production progresscomparing/calculating unit, a fabrication device status monitor step, an inventory controlstep, and a process shelf controller step. In response to a timing signal from thefabrication device status monitor step, the production progress comparing/calculatingunit determines a semiconductor wafer to be processed next, and the determinedsemiconductor wafer is automatically searched for on a process shelf. The fabricationdevices of a semiconductor wafer production line start processing semiconductor wafersat suitable times thereby producing semiconductor wafers according to a productionplan and meeting a delivery time for the semiconductor wafers.

申请人：NEC CORPORATION

代理机构：Sughrue, Mion, Zinn, Macpeak & Seas, PLLC

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