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MN102H76G资料

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MN102H76GTypeROM (×8-bit)RAM (×8-bit)PackageMinimum InstructionExecution TimeInterruptsMN102H76G128 K4 KQFP084-P-1818E *Lead-free83 ns (at 3.135 V to 3.465 V, 12 MHz)External (7 lines)Internal (28 lines) :Timer × 11, A/D × 1, Undefined command × 1, RESET × 1, OSD × 2, Serial × 2,I2C × 1, Caption × 2, Remote control × 1, Address coincidence × 4, HSYNC× 1, VSYNC× 18-bit timer × 10Watchdog timer: 17-bit × 1I2C × 1: for multimaster mode, bus line (output) has 2 systemsSync serial / UART × 1• Built-in sync separator × 1Timer CounterSerial InterfaceCaptionI/O PinsA/D InputsPWMSpecial PortsCRTCNotesI/O35• Common use10-bit × 8-ch. (with S/H)8-bit × 6-ch.Remote control reception3-layer display (graphics, characters, splits)Remote control input discriminant circuit built-in,build-in NTSC video signal processing circuit, built-in 3-line comb filterMAE00018BEM

MN102H76G

Pin AssignmentP07, ADIN7, VDAFP06, ADIN8, HDAFP05, ADIN5P04, ADIN4P03, ADIN3P02, ADIN2P01, ADIN1P00, ADIN0/TES6362616059585756555352515049484744P15, RMIN, /IRQ7*P16, SDA0*P17, SCL0P20, WDOUTP21, STOP, VOUT0P27, SBT0P30, SBD0P31, SBO0*P32, SDA1*P33, SCL1P34, PWM0P35, PWM1P36, PWM2DVDDDVSSP22, SYSCLK*P23, TM5IO*P26, TM8IOP43, /RSTP44, /IRQ0P45, /IRQ1656667686970717273747576777879808182838443SCOMPDVDDDVDDAVDDSIREFBOUTDVSSAVSSOSC2OSC1VCOIPDO424140393837363534GOUTROUTVIREFVCOMPVMOUTAVDDFBPINAVSSEWVOUTAVDDFSCOUTFSCINFPCOAVSSFVCOIHOUTHDOWNEHTINBEAMINABLINMN102H76G

33323130292827262524232215 10111213141617181920P37, PWM3P40, PWM4P41, PWM5VREFMMCOMPINVREFLMSCINMVINCLHMUINCLLP46, /IRQ2P47, /IRQ3P14, TM4IOP50, /IRQ4P51, IRQ5VREFHQFP084-P-1818E *Lead-free

*5 V dielectric Nch open drain output pin

Support Tool

In-circuit EmulatorPX-ICE102H76-QFP084-P-1818EMAE00018BEM

CREFHCREFLAVDDAVSS211234567Request for your special attention and precautions in using the technical information

and semiconductors described in this material

(1)An export permit needs to be obtained from the competent authorities of the Japanese Government if any of

the products or technical information described in this material and controlled under the \"Foreign Exchangeand Foreign Trade Law\" is to be exported or taken out of Japan.(2)The technical information described in this material is limited to showing representative characteristics and

applied circuits examples of the products. It neither warrants non-infringement of intellectual property rightor any other rights owned by our company or a third party, nor grants any license.(3)We are not liable for the infringement of rights owned by a third party arising out of the use of the technical

information as described in this material.(4)The products described in this material are intended to be used for standard applications or general elec-tronic equipment (such as office equipment, communications equipment, measuring instruments and house-hold appliances).

Consult our sales staff in advance for information on the following applications:

•Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-tion equipment, life support systems and safety devices) in which exceptional quality and reliability arerequired, or if the failure or malfunction of the products may directly jeopardize life or harm the humanbody.

•Any applications other than the standard applications intended.(5)The products and product specifications described in this material are subject to change without notice for

modification and/or improvement. At the final stage of your design, purchasing, or use of the products,therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-tions satisfy your requirements.(6)When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will notbe liable for any defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence ofbreak down and failure mode, possible to occur to semiconductor products. Measures on the systems suchas redundant design, arresting the spread of fire or preventing glitch are recommended in order to preventphysical injury, fire, social damages, for example, by using the products.(7)When using products for which damp-proof packing is required, observe the conditions (including shelf life

and amount of time let standing of unsealed items) agreed upon when specification sheets are individuallyexchanged.(8)This material may be not reprinted or reproduced whether wholly or partially, without the prior written

permission of Matsushita Electric Industrial Co., Ltd.

2003 SEP

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