专利名称：A method of mounting a plurality of
electronic parts on a circuit board
发明人：Isao, Tsukagoshi,Naoki, Fukushima,Kouji,
Kobayashi,Jyunichi, Koide,Kazuya, Matsuda
申请号：EP97113530.6申请日：19970806公开号：EP0824270A2公开日：19980218
专利附图：
摘要：A method of mounting electronic parts (1) on a circuit board (9) comprises: anadhesive layer formation step of forming, on an electrode surface of each electronic part(1) on which electrodes are formed, a film-like thermosetting adhesive layer (4) having anarea substantially equal to that of the corresponding electrode surface, to obtainadhesive-coated electronic parts; a positioning step of placing the electrodes on which
the adhesive layer is formed so as to face corresponding electrodes of the circuit board(9) and positioning the electrodes (12) relative to each other; and a heat-pressurebonding step of applying heat and pressure to the electrodes of the electronic parts (1)and the electrodes of the circuit board to fix the electrodes to each other after theelectrodes are positioned. Almost no adhesive superfluously comes out of the electrodesurfaces. Accordingly, when mounting the electronic parts (1) on the circuit board (9), it isunnecessary to remove superfluous adhesive, unlike conventional process, whereby theefficiency is improved and also the cost can be cut down.
申请人：HITACHI CHEMICAL CO., LTD.
地址：1-1, Nishishinjyuku 2-chome Shinjyuku-ku, Tokyo 163 JP
国籍：JP
代理机构：Patentanwälte Gesthuysen, von Rohr, Weidener, Schüll, Häckel
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