CIRCUIT BOARD STRUCTURE FOR ELECTRICAL TESTING AND

专利名称：CIRCUIT BOARD STRUCTURE FOR

ELECTRICAL TESTING AND FABRICATIONMETHOD THEREOF

发明人：Pao-Hung Chou申请号：US12045140申请日：20080310

公开号：US20080185177A1公开日：20080807

专利附图：

摘要：The invention provides a circuit board structure for electrical testing and afabrication method thereof. The circuit board structure includes: a core board having a

plurality of first circuits, an electroplating conductive wires, and distributing wires forelectrical connection thereof; a dielectric layer formed on the core board, the firstcircuits, the distributing wires and the electroplating conductive wires, wherein thedielectric layer is formed with at least one opening for exposing the distributing wires; aplurality of second circuit formed on the dielectric layer and electrically connected to thefirst circuits; a solder mask layer formed on the dielectric layer and the second circuits;and at least one first opening formed in the solder mask layer, above the distributingwires, and deep into the dielectric layer to create a broken circuit between the

distributing wires and the electroplating conductive wires, thus enabling electrical testingof the circuit board structure, and reducing noise interference.

申请人：Pao-Hung Chou

地址：Hsin-Chu TW

国籍：TW

更多信息请下载全文后查看